PhoxTroT’s specific S&T objectives are:
Create the optimal synergies between different technology platforms streamlining their deployment towards Tb/s-scale, high-performance, low-cost and low-energy optical interconnect components and sub-systems.
Address optical interconnects in a holistic way and deploy the necessary design- and process-level framework for translating individual interconnect component- and subsystem technology advances into true system-level performance, cost and energy benefits.
Develop high performance, low-cost and low-energy generic building blocks that can be used for a broad range of applications along all relevant optical interconnect hierarchy layers.
Deploy a whole new class of high-performance intra-chip optical/electrical TSVs and chip-to-board / board-to-board interfaces.
Deploy a unified integration/packaging methodology for board-adaptable 3D System-in-Package (SiP) transceiver and router optochip fabrication.
Establish Optical Packet Switch Transport (OPST) and Advanced Modulation Format concepts as performance-enhancing and energy-reducing principles in the domain of datacom device technologies.
Demonstrate the “power” of its technology “food chain” by deploying and experimentally demonstrating three major prototype units with breakthrough performance and energy metrics for on-board, board-to-board and rack-to-rack interconnects
Bring European research and industry at the fore-front of the optical interconnect field through road mapping, dissemination and training activities, strengthening its collaborative framework with DataCenter and HPC organizations.